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Beijing forms the third-generation semiconductor industry chain layout

Source: Time:2018-12-26 11:36:31 views:

        Yan Lixin, director of the Zhongguancun Science Park Management Committee, said recently that Beijing has basically formed the entire industrial chain layout of the third-generation semiconductor.

        Recently, the Global Finals of the 3rd Generation Semiconductor Professional Competition of China Innovation and Entrepreneurship Competition was held recently in Shunyi District, Beijing. At the meeting, Yan Lixin said that the Zhongguancun Demonstration Zone has more than half of the research and education resources in China's semiconductor field, cultivating and agglomerating a group of innovative enterprises with key core technologies and cutting-edge original technological achievements, especially in Shunyi Park. The entire industrial chain layout of the third generation semiconductor.


semiconductor


        Third-generation semiconductor materials have larger forbidden band widths than first- and second-generation semiconductor materials, which can significantly improve the performance of semiconductor devices. The third generation semiconductor materials mainly include silicon carbide (SiC), aluminum nitride (AlN), gallium nitride (GaN), diamond, etc., which are suitable for high temperature and radiation resistant applications. In 2016, the State Council issued the “13th Five-Year National Science and Technology Innovation Plan”, in which the third generation semiconductor is an important part of the research and development of new materials. Today, Beijing, Wuxi, Chengdu, Shenzhen and other places are actively occupying the commanding heights of this industry.

        The third-generation semiconductor materials market is developing rapidly and is an important part of Beijing's high-tech industry. It is also one of the three innovative industrial clusters identified by Shunyi. At the end of 2017, “Beijing's third-generation semiconductor innovation industry cluster” was listed in Shunyi District. At present, the agglomeration area focuses on building an open international public R&D, technological innovation and achievement transformation technology service platform, accelerating the entire industrial chain of layout substrates, extensions, chips, devices, modules and leading application enterprises with remarkable results. The international third-generation semiconductor Zhonglian Space has been rated as a national-level public space by the Ministry of Science and Technology, and more than 50 companies have entered the incubator; the third-generation joint innovation base for semiconductor materials and applications has been completed this month, with a total area of 71,000 square meters. A total of 105 member units have been established; a number of key projects such as the ITW Switch, 13 of the China Electronics Group, the CLP headquarters of the CLP Group, the Pinghu Boco Semiconductor Chip, and the Hanergy Mobile Energy Center have successively landed.

        From the 20th to the 22nd, the China Global Innovation and Entrepreneurship Competition, the third-generation semiconductor professional competition, was held in Beijing. The event was co-sponsored by the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance and the Beijing Shunyi District People's Government, and was organized by the Shunyi Park Management Committee of Zhongguancun Science and Technology Park. After half a year of collection and selection, the contest gathered more than 570 quality projects and excellent teams to sign up for the competition. At the same time, the competition opened a large-scale SMEs specialization, invited new energy smart cars, high-end equipment and other leading enterprises to participate in the meeting, to achieve large-scale SMEs development and innovation projects collaborative innovation.


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