Advanced Energy's accelerated ion beam source, inductive coupled plasma source and atmospheric source technology provide a sophisticated and modern design for your advanced process. The result is seamless integration, superior reliability and advanced functionality, driving, simplifying your process and making it a step further.

一、Litmas® RPS 1501 and 3001 remote plasma source platforms

        Advanced Energy Litmas® RPS is the only fully integrated remote sensing plasma source and power supply system with a high conductivity, low surface area structure. It is well suited for providing reactive gases for wafer pre-cleaning, photoresist stripping and atomic layer deposition (ALD) processes. In addition, its high power density and high conductivity make it an ideal platform for post-treatment waste gas treatment. Litmas RPS delivers up to 3 kW of stable RF power in less than 3 milliseconds, enabling rapid changes in 90 nm and 300 nm processes.

Advantage	Features
• Reduces charge damage to the fragile device structure • High reactant flux generation Extensive range of chemical chemistry • Fast match, stable power supply • Cost reduction • Enhanced end-user process development and output	• Integrated power supply, matching and plasma chamber • Patented LitmasMatch ™ solid state power supply topology • Plug and play installation Extremely wide range of matches Durable SiO2 or Al2O3 chamber material • Small size • Highest plasma power density • The change between source and source is minimal

二、 Litmas® RPS front pipe PFC treatment

        The Advanced Energy Litmas® RPS system is a precursor piping solution that reduces the global warming impact of semiconductor processes. This high-performance linear inductive plasma source fully integrates a 2 MHz power supply and a matching circuit. Its use in CVD, etch and ashing applications has a wide range of impedances.

三、Xstream® remote plasma source

        Advanced Energy The efficient Xstream® remote plasma source platform produces neutral active species from stable feed gases for surface modification, chamber cleaning, film etching, and plasma assisted deposition. The Xstream platform, which is installed outside the process chamber, integrates a remote plasma source, a 6 kW or 8 kW efficient power supply, and a patented solid state active matching network. The network has the widest commercial impedance range on a chamber cleaning source. The Xstream remote plasma source gives process engineers an unparalleled flexibility in process gas technology, improving system throughput and optimizing the use of expensive resources.

Advantage	Features
• Optimize the use of expensive resources • Provide the widest range of commercial impedance operation • Can be operated seamlessly under a variety of chemical reactions, including existing PFC / O2 in-situ chamber cleaning methods • Improve process performance, flexibility and throughput • Simplified improvements to on-site and remote VCD chamber cleaning • Take advantage of the previously patented AE active matching network technology	• Active matching network on solid state board • Fully integrated and efficient 400 kHz power supply • Optional virtual front panel (VFP) Intuitive, instant, software-based user interface • Water consumption is small • Anodized hard, fine particles, anti-corrosion metal source chamber • Advanced monitoring circuit that can measure the actual power supply to the plasma • Readback signals for system integration and monitoring